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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays 1/ 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com clock generator for audio/video equipment bu2363fv general description bu2363fv is a clock generator ic capable of generating three types of clocks - video, audio and system clocks that are necessary for dvd player systems. it is a single chip solution that uses pll technology. particularly, the video clock is a dvd - audio reference and yet achieves high c/n characteristics necessary to provide high definition images. features ? connecting a crystal oscillator generates multiple clock signals from a built - in pll circuit . ? the audio clock provides switching selection outputs ? the video clock achieves high c/n characteristics. ? single power supply of 3.3 v applications dvd players key specifications package w (typ) x d(typ) x h(max) typical application circuit (note) we believe that this circuit is to be re commended. however, to use it, make further thorough check for the characteristics. part name bu2363fv supply voltage range [v] 3.0 to 3.6 re ference frequency [mhz] 36.8640 output frequency [mhz] dvd video 2 54.0000 1 27.0000 dvd / cd audio (switching outputs ) 768fs 36.8640 33.8688 384fs 18.4320 16.9344 system 768fs 33.8688 384fs 16.9344 jitter 1 [psec] (video) - 80 operating temperature range [c] - 10 to +70 0.1f 0.1f 0.1f ssop - b 16 5.00 mm x 6.40mm x 1. 35 mm open:enable 1:vdd2 16:oe l :disable 0.1uf 2:vss2 15:clk33m 33.8688mhz 54.0000mhz 3:clk254m 14:fsel open:48.0khz type l :44.1khz type 27.0000mhz 4:clk27m 13:clk16m 16.9344mhz 5:avdd 12:dvdd 0.1uf 0.1uf 6:avss 11:dvss 7:xtalin 10:768fs1 36.8640mhz or 33.8688mhz 8:xtalout 9:384fs2 18.4320mhz or 16.9344mhz bu2363fv datashee t datashee t
b u2 363 fv 2 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 pin configuration fsel clk768fs clk384fs l 33.8688mhz 16.9344mhz open 36.8640mhz 18.4320mhz pin description s ( note) basically, mount ics to the printed circuit board for use. (if the ics are not mounted to the printe d circuit board, the characteristics of ics may not be fully demonstrated.) mount 0.1 f capacitors in the vicinity of the ic pins between pin 1 (vdd 2 ) and pin 2 (vss 2 ), pin 5 (av dd ) and pin 6 (av ss ), pin 11 ( d v ss ) and pin 12 ( d v dd ), respectively. depending on the conditions of the printed circuit board, mount an additional el ectrolytic capacitor between the power supply and gnd terminal. for emi protection, it is effective to put ferrite beads in the origin of power to be supplied to the bu2363fv from the b oard or to ins ert a capacitor (of not more than 1 ? 1:vdd2 16:oe 2:vss2 15:clk33m 3:clk254m 14:fsel 4:clk27m 13:clk16m 5:avdd 12:dvdd 6:avss 11:dvss 7:xtalin 10:768fs1 8:xtalout 9:384fs2 bu2363fv b u2 363 fv 3 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 block diagram absolute ma ximum ratings (ta=25 c ) parameter symbol rating unit supply voltage v dd - 0.5 to xtal osc xtalin=36.8640mhz 1/8 1/4 multi-pll technology pll2 1/4 1/8 1/2 (fsel=open:36.8640mhz fsel=l :33.8688mhz) (fsel=open:18.4320mhz fsel=l :16.9344mhz) 7:xtalin 8:xtalout 3:clk54m 10:768fs1 16:oe 14:fsel (54.0000mhz) (fsel=open:48.0khz type fsel=l :44.1khz type) 4:clk27m (27.0000mhz) 15:clk33m (33.8688mhz) 13:clk16m (16.9344mhz) 9:384fs2 b u2 363 fv 4 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 electri cal characteristics ( v dd =3.3v, ta=25 c , crystal frequency 36.8640mhz, unless otherwise specified. ) parameter symbol min typ max unit conditions output l voltage v ol ? ? b u2 363 fv 5 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 2. 54mhz period - jitter ( v dd =3.3v, at c l =15pf ) 500psec / div 1.0v / div fig ure 3. 54mhz spectrum ( v dd =3.3v, at c l =15pf ) 10khz / div 10db / div rbw=1khz vbw= 100hz fig ure 4 . 27mhz output waveform ( v dd =3.3v, at c l =15pf ) 5.0nsec / div 1.0v / div fig ure 1. 54mhz output waveform ( v dd =3.3v, at c l =15pf ) 3.0nsec / div 1.0v / div typical performance curves ( b asic data ) b u2 363 fv 6 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 6. 27mhz spectrum ( v dd =3.3v, at c l =15pf ) 10khz / div 10db / div rbw=1khz vbw=100hz fig ure 7. 33.9 mhz output waveform ( v dd =3.3v, at c l =15pf ) 5.0nsec / div 1.0v / div fig ure 8. 33.9mhz period - jitter ( v dd =3.3v, at c l =15pf ) 500psec / div 1.0v / div typical performance curves C b u2 363 fv 7 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 10. 16.9mhz output waveform ( v dd =3.3v, at c l =15pf ) 10.0nsec / div 1.0v / div fig ure 11. 16.9mhz period - jitter ( v dd =3.3v, at c l =15pf ) 500psec / div 1.0v / div fig ure 12. 16.9mhz spe ctrum ( v dd =3.3v, at c l =15pf ) 10khz / div 10db / div rbw=1khz vbw=100hz typical performance curves C b u2 363 fv 8 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 1 5 . 36.9mhz spectrum ( v dd =3.3v, at c l =15pf ) 10khz / div 10db / div rbw=1khz vbw=100hz fig ure 16. 18.4mhz output waveform ( v dd =3.3v, at c l =15pf ) 10.0nsec / div 1.0v / div fig ure 14. 36.9mhz period - jitter ( v dd =3.3v, at c l =15pf ) 500psec / div 1.0v / div typical performan ce curves C b u2 363 fv 9 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 18. 18.4mhz spectrum ( v dd =3.3v, at c l =15pf ) 10khz C b u2 363 fv 10 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 v dd =2.9v v dd =3.3v v dd =3.7v typical performance curves C 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature b u2 363 fv 11 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 v dd =2.9v v dd =3.3v v dd =3.7v v dd =2.9v v dd =3.3v v dd =3.7v v dd =3.3v v dd =2.9v v dd =3.7v typical performance curves C 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature ] b u2 363 fv 12 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 fig ure 28. duty vs temperature ( 16.9mhz ) v dd =2.9v v dd =3.3v v dd =3.7v v dd =2.9v v dd =3.3v v dd =3.7v v dd =2.9v v dd =3.3v v dd =3.7v typical performance curves C 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature b u2 363 fv 13 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 v d d =2.9v v dd =3.3v v dd =3.7v v dd =3.3v v dd =2.9v v dd =3.7v typical performance curves C 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 45 46 47 48 49 50 51 52 53 54 55 -25 0 25 50 75 100 temperature 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] b u2 363 fv 14 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 typical performance curves C 0 100 200 300 400 500 600 -25 0 25 50 75 100 temperature 0 10 20 30 40 50 60 70 80 90 100 -25 0 25 50 75 100 temperature p erio d-ji tte r1 p j-1 [psec] 0 10 20 30 40 50 -25 0 25 50 75 100 temperature b u2 363 fv 15 / 19 tsz02201 - 0e3e0j500690 - 1 - 2 ? 20 1 5 rohm co., ltd. all rights reserved. 04.nov.2015 rev.001 www.rohm.com tsz22111 15 001 operational notes 1. reverse c onnection of p ower s upply connecting the power supply in re verse polarity can damage the ic. take pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to p rovide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block . furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. g round w iring p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. in rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. t herefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or ste s 7 k h , & |